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Structure
Silicon Monolithic Integrated Circuit
Product Name
RGB Illumination LED Driver for mobile phone
Type
BD2812GU
RGB LED driver A slope control function is incorporated Slope control can be implemented using the DC current. Two modes "continuous illumination mode" and "illumination single cycle mode" are supported. Independent external ON/OFF synchronizing terminals (of dual drivers) are provided. Low consumption operation is possible by the sleep operation mode function. Charge pump system DC/DC built-in.
Features
Absolute Maximum Ratings (Ta=25 ) Parameter Maximum Applied voltage Power Dissipation Operating Temperature Range Storage Temperature Range Symbol VMAX Pd Topr Tstg 1460 Limits 7 Note1 Unit V mW
-40 ~ +85 -55 ~ +150
note1Power dissipation deleting is-11.68mW/ , when it's used in over 25 . (It's deleting is on the board that is ROHM's standard) Dissipation by LSI should not exceed tolerance level of Pd.
Operating conditionsVBATVIO, Ta=-40~85 Parameter VBAT input voltage VIO pin voltage Symbol VBAT VIO Limits 2.7 ~ 5.5 1.65 ~ 3.3 Unit V V
* Radiation-proof is not designed.
REV. A
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Electrical Characteristics (Unless otherwise specified, Ta=25C, VBAT=3.6V, VIO=1.8V) Parameter Circuit Current VBAT Circuit current 1 VBAT Circuit current 2 VBAT Circuit current 3 VBAT Circuit current 4 VBAT Circuit current 5 VBAT Circuit current 6 VBAT Circuit current 7 LED Driver LED current Step LED Maximum setup current LED current accurate
ILEDSTP
Symbol
Min.
Typ.
Max.
Unit A A mA mA mA mA A
Condition
IBAT1 IBAT2 IBAT3 IBAT4 IBAT5 IBAT6 IBAT7
-
0.1 0.5 0.8 61 92 123 5
3.0 3.0 1.2 65 102 140 7.5
RESETB=0V, VIO =0V RESETB=0V, VIO=1.8V LED 6Ch ON, ILED=10mA setting Exclusive of LED current, RGBISET =120k DC/DC x1mode, Io=60mA, VBAT=4.0V DC/DC x1.5mode, Io=60mA, VBAT=3.6V DC/DC x2mode, Io=60mA, VBAT=2.7V External clock Sleep operation mode External clock = 31.25kHz, ILED=0mA RGB1 group, RGB2 group RGB1 group, RGB2 group RGBISET=100k RGB1 group, RGB2 group, Terminal voltage =1V ILED=20mA setting, RGBISET =120k RGB1 group, between RGB2 group, Terminal voltage =1V ILED=20mA setting
128 18 20 30.48 22
step mA mA
IMAX ILED
LED current Matching LED OFF Leak current DC/DC (Charge Pump) Output voltage 1
ILEDMT ILKL
-
5 -
10 1.0
% A
VoCP1
-
Vf+0.2 3.9 4.2 4.5 4.8 1.0 6.0 250
Vf+0.25 4.095 4.41 4.725 5.04 255 1.2 6.5 375
V V V V V mA MHz V mA
At output voltage auto mode, Vf is forward direction voltage of LED
3.705 Output voltage 2 VoCP2 3.99 4.275 4.56 Load stability Oscillator frequency Over voltage protection detect voltage Over current protection detect current SDA, SCL (I C interface ) VILI VIHI VhysI VOLI linI -0.3 0.75 x VIO 0.05 x VIO 0 -10
2
At fixed voltage output mode, Io=60mA VBAT3.2V
Iout fosc OVP OCP
0.8 -
VBAT3.2V, VOUT=4V
VOUT=0V
L level input voltage H level input voltage Hysteresis of Schmitt trigger input L level output voltage Input current
-
0.25 xVIO VBAT+0.3 0.3 10
V V V V A SDA pin, IOL=3 mA Input voltage = 0.1xVIO~ 0.9xVIO
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Electrical Characteristics(Unless otherwise specified, Ta=25, VBAT=3.6V, VIO=1.8V Parameter RESETB Symbol Min. Typ. Max. Unit Condition
(CMOS input pin) VILR VIHR IinR VILCNT VIHCNT IinCNT (CMOS output pin) VOLCLK VOHCLK fclk1 fclk2 VIO -0.2 200 25 250 31.25 0.2 300 37.5 V V kHz kHz IOL=1mA IOH=1mA FSEL=0 setting FSEL=1 setting -0.3 0.75 x VIO -10 -0.3 0.75 x VIO 3.6 0.25 xVIO VBAT+0.3 10 0.25 xVIO VBAT+0.3 10 V V A V V A Input voltage = 1.8V Input voltage = 0.1xVIO~ 0.9xVIO
L level input voltage H level input voltage Input current RGB1CNT, RGB2CNT L level input voltage H level input voltage Input current CLKIOOutput L level output voltage H level output voltage Output frequency1 Output frequency2 CLKIO (Input) L level input voltage H level input voltage Input current
(CMOS input pin with Pull-down resistance)
(CMOS input pin with Pull-down resistance) VILCLK VIHCLK IinCLK -0.3 0.75 x VIO 3.6 0.25 xVIO VIO+0.3 10 V V A Input voltage = 1.8V
Package
1PIN MARK
Lot No.
BD2812
3.10.05 0.250.1 1.0MAX S 0.06 S
32-0.300.05 0.05 AB F E D C B A 1 0.30.05 2345 P=0.5x5 6 A
(0.15) INDEX POST
B
P=0.5x5
0.30.05
3.10.05
VCSP85H3 unit:mm
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Block Diagram
CPGND C1N C2N C1P C2P
Pin Functions PIN
VOUT
PIN NAME VBATCP VBAT1 VBAT2 T1 T2 T3 T4 VIO RESETB SDA SCL CPGND GND1 GND2 RGBGND C1N
PIN C5 A5 C6 D6 D5 E2 E6 E5 F5 E4 E3 F3 D2 D1 B4 C2
PIN NAME C1P C2N C2P VOUT VOUTM RGBISET R1LED G1LED B1LED R2LED G2LED B2LED RGB1CNT RGB2CNT ADDSEL CLKIO
VBATCP VBAT2 VBAT1
Charge Pump
Charge Pump Mode Control
B6 F2 C1
x1 / x1.5 / x2
OVP
VOUTM
R1LED
VIO
LED port voltage Feedback
A1 A6 F6 F1 A2 A3 B3 B2
Slope Control (RGB1)
G1LED
RESETB
B1LED
SCL
R2LED
Level
SDA
I2C interface Digital Control
I/O Shift
Slope Control (RGB2)
G2LED
B2LED
RGB1CNT RGBGND RGB2CNT
CLKIO
ADDSEL CLKIO
A4 E1
RGBISET
IREF
VREF TSD
B1
GND1 GND2
T1
T3
T2
T4
F4 B5
Cautions on use
(1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Power supply and ground line Design PCB pattern to provide low impedance for the wiring between the power supply and the ground lines. Pay attention to the interference by common impedance of layout pattern when there are plural power supplies and ground lines. Especially, when there are ground pattern for small signal and ground pattern for large current included the external circuits, please separate each ground pattern. Furthermore, for all power supply pins to ICs, mount a capacitor between the power supply and the ground pin. At the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (3) Ground voltage Make setting of the potential of the ground pin so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no pins are at a potential lower than the ground voltage including an actual electric transient. (4) Short circuit between pins and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between pins or between the pin and the power supply or the ground pin, the ICs can break down. (5) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (6) Input pins In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input pin. Therefore, pay thorough attention not to handle the input pins, such as to apply to the input pins a voltage lower than the ground respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input pins a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (7) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (8) Thermal shutdown circuit (TSD) This LSI builds in a thermal shutdown (TSD) circuit. When junction temperatures become detection temperature or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (9) Thermal design Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use. (10) LDO Use each output of LDO by the independence. Don't use under the condition that each output is short-circuited because it has the possibility that an operation becomes unstable. (11) About the pin for the test, the un-use pin Prevent a problem from being in the pin for the test and the un-use pin under the state of actual use. Please refer to a function manual and an application notebook. And, as for the pin that doesn't specially have an explanation, ask our company person in charge. (12) About the rush current For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of wiring. (13) About the function description or application note or more. The function description and the application notebook are the design materials to design a set. So, the contents of the materials aren't always guaranteed. Please design application by having fully examination and evaluation include the external elements.
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Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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